NIC has established global manufacturing centers of excellence to provide cost-effective products with the highest levels of quality. Our integrated team approach - engineering, manufacturing and quality - ensures that NIC transfers value to our customer from design through volume production.
NIC is ISO 9001:2000 certified and its facilities occupy over 20,000 square feet. We operate highly automated and dynamic assembly lines which allow NIC to monitor a wide variety of products in production at the same time. From special vision systems to automated tuning stations, solder reflow and crystal tuning to precise tooling in our own machine shop, NIC can produce efficient and high quality products for our customers.
NIC has developed proprietary software to link analyzers to computer-driven automated test stations that require minimal operator intervention during final testing. This allows NIC to reduce cycle time and analyze and provide customers real time measured data.
NIC offers a wide variety of environmental testing capabilities in-house, which allows us to guarantee that quality and reliability meets the requirements of our customer’s application. NIC conducts 100% ESS screening on all product manufactured. Testing is automated to increase efficiency and ensure high performance in all conditions. Examples of environmental testing equipment include moisture resistance, temperature/ altitude chambers, thermal shock chambers, automated vibration system, and phase noise testing. The table below lists NIC's screening capabilities. Please contact NIC with your specific requirements.
| 100% Environmental Stress Screening (ESS) |
| Visual - Precap
Thermal Shock
Hermeticity
Final Electrical
Final Visual |
Mil-STD-883, Method 2017 or IPC-610A
MIL-STD-202, Method 107 or
MIL-STD-883, Method 1011
MIL-STD-202, Method 112D
MIL-STD-883, Method 1002
MIL-F-18327E or ATP
MIL-F-18327E or ATP |
| |
| In-House Environmental Test Capabilities |
Vibration
- Random
- High Frequency Sinusoidal
Shock
Hermeticity (Fine Leak)
Barometric Pressure
Acceleration
Humidity
Moisture Resistance
Life
Salt Spray
Additional Environmental Tests
|
MIL-STD-202, Method 214
MIL-STD-202, Method 204
MIL-STD-202, Method 213
MIL-STD-202, Method 112C
MIL-STD-202, Method 105
MIL-STD-202, Method 212A
MIL-STD-202, Method 103
MIL-STD-202, Method 106
MIL-STD-202, Method 108
MIL-STD-202, Method 101
Phase Noise under Vibration
Temperature Altitude
Pressure Cycling |
Recommended SMT Installation
The following is NIC's suggested guidelines for Surface Mount (SMT) installation. A typical reflow profile is provided below. Mass of all components and Circuit Card Assembly should be considered when establishing a reflow procedure. Higher density board populations may take longer to achieve reflow temperatures. The temperatures shown below are the temperatures at the NIC component.
NIC builds its surface mount components using high temperature solders. Standard alloys (Sn63) should be used for installation.
NIC products can be cleaned with aqueous and semi-aqueous systems. Parts should be thoroughly baked after cleaning to prevent entrapment of moisture.
The rate of heating and cooling must be controlled to avoid thermal cracking of internal components. Processes, heating or cooling should not exceed a rate of 200°C per minute. Spikes must not exceed 100°C maximum for any solder operation. Avoid forced cooling or contact with heat sinks, such as conveyor belts, metal tables or cleaning solutions, before the units reach ambient temperatures.
| Typical Reflow Profile |
 |
Please contact NIC for specific requirements or questions. |
